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FCM
Like other flip chip machines, the bonding process can be divided into five parts: loading, alignment, placement, bonding and unloading. Each unit on the FCM bonder is designed to carry out these operations as quickly and as accurately as possible.
The FCM flip chip bonder is a very simple, yet cleverly designed, machine. It has all the features needed to carry out successful bonding, including vertical bonding movement and placement separating to ensure no scuffing. |
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ACP
ChipPegasus Universal Diebonder
+ Best for Flexible Production and Development Environment
+ Extremely Powerful and Simple Software
+ Excellent Price-Performance Ratio
+ Very high Accuracy
The LiCONiC ChipPegasus diebonder is the new tool for development and mid-size production. With its 5 micron accuracy the ChipPegasus fullfills every need in modern microelectronic manufacturing. The new Liconic ChipPegasus diebonder software combines a powerful production user interface. Most operations of the Windows based user interface are self explaning.
The new Liconic ChipPegasus offers a large active working area which provides room for various applications. |
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